Chips and edge compute
Qualcomm Dragonwing IQ-9075 (IQ9 Series)
United States
Qualcomm's frontal assault on NVIDIA Jetson: a full robotics stack unveiled at CES 2026, from household robots to full-size humanoids, with Figure and KUKA among named partners and a power-efficiency pitch inherited from mobile.
VendorQualcomm
CountryUS
TypeSoC
AI perf100 TOPS dense / 200 TOPS sparse (INT8, Hexagon NPU)
AvailabilityEVK and modules available (2025-2026); flagship Dragonwing IQ-10 for humanoids in early access June 2026, global availability targeted September 2026
Memory36 GB LPDDR5 (EVK configuration)
Form factorSoC; EVK, SMARC modules and robot controllers from Lantronix, Advantech, Tria
Applicationshumanoid, AMR, industrial, drone, vision
Used byFigure (partnership announced CES 2026), Booster Robotics (partner), KUKA Robotics (partner)
Sources : Qualcomm (2026-07-09)Qualcomm Newsroom (2026-01-06)Lantronix (2026-07-09)Electronics Media (2026-06-29)
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